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Global Molded Interconnect Device Market Forecast to 2025 | Depth Analysis with Top Key Players: MacDermind Inc., Molex Llc, LPKF, TE Connectivity, HARTING Technology Group, Arlington Plating Company

This Global Molded Interconnect Device Market report comprises of most-detailed market segmentation, systematic analysis of major market players, trends in consumer and supply chain dynamics, and insights about new geographical markets. A systematic investment analysis is also underlined in this Global Molded Interconnect Device Market report which forecasts impending opportunities for the market players.

This market report contains the company profiles, product specifications, capacity, production value, and market shares of each company for the forecasted period of 2018-2025. All statistical and numerical data included in the report is characterized with the help of graphs and charts which makes it easy to understand the facts and figures.

Global Molded Interconnect Device Market, By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting and Others), Process Type (Laser Direct Structuring, Two-shot Molding, Others), End Users (Automotive, Consumer Products, Healthcare, Industrial, Military and Aerospace, Telecommunication and Computing, and Others), Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)– Industry Trends and Forecast to 2025

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The Global Molded Interconnect Device Market is expected to reach USD 2119.85 million by 2025, from USD 786.21 million in 2017 growing at a CAGR of 13.2% during the forecast period of 2018 to 2025. The upcoming market report contains data for the historic year 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.

Major Players:

Few of the major competitors currently working in the miticides market are Syngenta, Gowan Company, BASF SE, Bayer AG, Arysta LifeScience Corporation, FMC Corporation, UPL, Mantis Plant Protection LLC, and DowDuPont.

 Competitive Analysis: 

The global molded interconnect device market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of global molded interconnect device market for global, Europe, North America, Asia Pacific and South America.

Harting has collaborated with Ticona on developing antennas, security applications, commercial sensors etc. Recently DuPont has come up with a palladium doped 2-shot molding in MID.

 Major Market Drivers and Restraints:

  • High trends of wearable devices and its penetration in the market.
  • Increasing focus on reducing electronic wastes.
  • Increasing usage of MID in healthcare.
  • Internet of Things (IoT) and its growing demand among industries.
  • High costs of raw materials and tooling.
  • Extent of incompatibility with other electronic systems.

Table of Contents:

  1. Executive Summary
  2. Scope/opportunities of the Report
  3. Research Methodology
  4. Market Landscape
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis
  1. Pipeline Analysis
  • Pipeline analysis
  1. Market Sizing
  • Market definition
  • Market sizing
  • Market size and forecast

Porter’s Five Forces Analysis

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

Market Segmentation

  • Segmentation
  • Comparison
  • Market opportunity

Customer Landscape

Regional Landscape

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Market Segmentation:

  • The global molded interconnect device market is segmented based on product type, process type, end users, and geographical segments.
  • Based on the product, the market is further segmented into antennae and connectivity modules, sensors, connectors and switches, lighting and others.
  • Based on process, the market is further segmented into laser direct structuring, two-shot molding, others.
  • Based on end users, the market is further segmented into automotive, consumer products, healthcare, industrial, military and aerospace, telecommunication and computing, and others.
  • Based on geography the market report covers data points for 28 countries across multiple geographies namely North America & South America, Europe, Asia-Pacific and, Middle East  & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and Brazil among others.

 Customization of the Report

  • All segmentation provided above in this report is represented at country level.
  • All products covered in the market, product volume and average selling prices will be included as customizable options which may incur no or minimal additional cost (depends on customization)

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