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Global IO Link Market Analysis 2019 Top Companies are are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs

The market data described in the IO Link report helps to make out diverse market opportunities present worldwide for Semiconductors and Electronics industry. IO Link market research report has been framed with the systematic gathering and estimation of market information for Semiconductors and Electronics industry. This IO Link market report’s analytical study supports the mapping of growth strategies to increase sales and build brand image on the market. The market data described in the IO Link report helps to identify the worldwide Semiconductors and Electronics industry’s diverse market opportunities. Such market research reporting is always advantageous for any company to market products or services, whether it is a small or large-scale. This report provides accurate information on market trends, changes in industry, consumer behaviour, etc. All this information is supplied in such a form that properly gives explanation of various facts and figures to the business

The Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.

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Global IO Link Market, By Component (IO-Link Masters, IO-Link Devices), By Application (Machine Tool, Handling and Assembly Automation, Packaging, Intralogistics), By Industry (Discrete, Hybrid, Process), By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)– Industry Trends and Forecast to 2026

Competitive Analysis: 

The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.

Major Market Competitors/Players: Global IO Link Market

Few of the major competitors currently working in the IO Link Market are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs, Datalogic S.p.A., Comtrol, Beckhoff Automation GmbH & Co. KG, Baumer, Bosch Rexroth AG, ABB, Belden Inc., AVENTICS GmbH, and Weidmüller Interface GmbH & Co. KG.

Table of Contents:

 

  1. Introduction
  2. Market Segmentation
  3. Market Overview
  4. Executive Summary
  5. Premium Insights
  6. By Component
  7. Product Type
  8. Delivery
  9. Industry Type
  10. Geography
    • Overview
    • North America
    • Europe
    • Asia-Pacific
    • South America
    • Middle East & Africa
  11. Company Landscape
  12. Company Profiles
  13. Related Reports

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Market Definition: 

IO Link is an industrial communication networking device that is used for interlinking sensors to a high level fieldbus or ethernet communication  protocol. It provides the data from these sensors that can be used for monitoring and hence, helps in optimizing the resources being utilized in the said industry.

Market Drivers:

  • Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth
  • IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols

Market Restraints:

  • IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to restrain the market growth
  • Lack of standardization of IO Links is another factor that is expected to restrain the market growth

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Segmentation: 

  • By Component
    • IO-Link Masters
    • IO-Link Devices
      • Sensor Nodes
      • Modules
      • Actuators
      • Radio-Frequency Identification (RFID) Read Heads and Others
  • By Application
    • Machine Tool
    • Handling and Assembly Automation
    • Packaging
    • Intralogistics
  • By Industry
    • Discrete
    • Hybrid
    • Process

 

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Data Bridge set forth itself as an unconventional and neoteric Market research and consulting firm with unparalleled level of resilience and integrated approaches. We are determined to unearth the best market opportunities and foster efficient information for your business to thrive in the market. Data Bridge endeavors to provide appropriate solutions to the complex business challenges and initiates an effortless decision-making process.

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Email: sopan.gedam@databridgemarketresearch.com

 

 

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